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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | SPC5777CDK3MME4 |
| Description | MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES; |
| Datasheet | SPC5777CDK3MME4 Datasheet |
| In Stock | 80 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.2 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER |
| ADC Channels: | YES |
| No. of Terminals: | 416 |
| DMA Channels: | YES |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Address Bus Width: | 0 |
| Maximum Clock Frequency: | 40 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Width: | 27 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 264 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| Maximum Supply Voltage: | 1.32 V |
| External Data Bus Width: | 0 |
| Bit Size: | 32 |
| JESD-609 Code: | e2 |
| Length: | 27 mm |
| PWM Channels: | YES |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1 mm |
