
Image shown is a representation only.
Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | SPC5777CK3MMO3,557 |
Description | MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.32 V; |
Datasheet | SPC5777CK3MMO3,557 Datasheet |
In Stock | 814 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.2 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Seated Height: | 2.02 mm |
Surface Mount: | YES |
ADC Channels: | YES |
No. of Terminals: | 516 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B516 |
Maximum Clock Frequency: | 40 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | BGA |
Width: | 27 mm |
Speed: | 264 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 1.32 V |
External Data Bus Width: | 0 |
Bit Size: | 32 |
DAC Channels: | NO |
Length: | 27 mm |
PWM Channels: | YES |
Additional Features: | ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE. |
ROM Programmability: | FLASH |
Terminal Pitch: | 1 mm |