NXP Semiconductors - SPCZ563MZP56CR2

SPCZ563MZP56CR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPCZ563MZP56CR2
Description MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
Datasheet SPCZ563MZP56CR2 Datasheet
In Stock2,692
NAME DESCRIPTION
Minimum Supply Voltage: 4.75 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.55 mm
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 388
DMA Channels: NO
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PBGA-B388
Maximum Clock Frequency: 20 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Speed: 56 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 5.25 V
External Data Bus Width: 0
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Length: 27 mm
PWM Channels: YES
On Chip Program ROM Width: 8
Peak Reflow Temperature (C): 240
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
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