NXP Semiconductors - SSTU32865ET

SSTU32865ET by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SSTU32865ET
Description D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 160; Package Code: TFBGA; Package Shape: RECTANGULAR;
Datasheet SSTU32865ET Datasheet
In Stock3,016
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Output Characteristics: OPEN-DRAIN
Maximum Seated Height: 1.2 mm
Trigger Type: POSITIVE EDGE
Minimum Supply Voltage (Vsup): 1.7 V
Sub-Category: Other Logic ICs
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 160
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B160
Package Shape: RECTANGULAR
Terminal Form: BALL
Minimum fmax: 270 MHz
Maximum Operating Temperature: 70 Cel
Package Code: TFBGA
Width: 9 mm
No. of Bits: 28
Output Polarity: TRUE
Logic IC Type: D FLIP-FLOP
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA160,12X18,25
Length: 13 mm
Propagation Delay (tpd): 2.15 ns
Nominal Supply Voltage / Vsup (V): 1.8
Family: SSTU
Terminal Pitch: .65 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.9 V
Power Supplies (V): 1.8
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