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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | SSTUA32S865ET/G |
| Description | D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 160; Package Code: TFBGA; Package Shape: RECTANGULAR; |
| Datasheet | SSTUA32S865ET/G Datasheet |
| In Stock | 233 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Output Characteristics: | OPEN-DRAIN |
| Maximum Seated Height: | 1.2 mm |
| Trigger Type: | POSITIVE EDGE |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | Other Logic ICs |
| Surface Mount: | YES |
| No. of Terminals: | 160 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B160 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Minimum fmax: | 450 MHz |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | TFBGA |
| Width: | 9 mm |
| Moisture Sensitivity Level (MSL): | 2 |
| No. of Bits: | 28 |
| Output Polarity: | TRUE |
| Logic IC Type: | D FLIP-FLOP |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA160,12X18,25 |
| Length: | 13 mm |
| Propagation Delay (tpd): | 1.8 ns |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Family: | SSTU |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 2 V |
| Power Supplies (V): | 1.8 |
