SSTUB32864EC/G by NXP Semiconductors | Logic ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	SSTUB32864EC/G
Description	D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;
Datasheet	SSTUB32864EC/G Datasheet
In Stock	3,356

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Seated Height:	1.5 mm
Trigger Type:	POSITIVE EDGE
Minimum Supply Voltage (Vsup):	1.7 V
Sub-Category:	Other Logic ICs
Surface Mount:	YES
No. of Terminals:	96
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B96
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Minimum fmax:	450 MHz
Maximum Operating Temperature:	70 Cel
Package Code:	LFBGA
Width:	5.5 mm
Moisture Sensitivity Level (MSL):	2
No. of Bits:	14
Output Polarity:	COMPLEMENTARY
Logic IC Type:	D FLIP-FLOP
Minimum Operating Temperature:	0 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA96,6X16,32
Length:	13.5 mm
Propagation Delay (tpd):	1.5 ns
Nominal Supply Voltage / Vsup (V):	1.8
Family:	32864
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	2 V
Power Supplies (V):	1.8

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,356	-	-

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