NXP Semiconductors - SSTUB32868ET/S-T

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SSTUB32868ET/S-T by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SSTUB32868ET/S-T
Description D FLIP-FLOP; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR;
Datasheet SSTUB32868ET/S-T Datasheet
In Stock1,307
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Seated Height: 1.15 mm
Trigger Type: POSITIVE EDGE
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 176
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
JESD-30 Code: R-PBGA-B176
Package Shape: RECTANGULAR
Terminal Form: BALL
Minimum fmax: 450 MHz
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 6 mm
No. of Bits: 28
Output Polarity: TRUE
Logic IC Type: D FLIP-FLOP
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
Qualification: Not Qualified
Length: 15 mm
Propagation Delay (tpd): 3 ns
Nominal Supply Voltage / Vsup (V): 1.8
Family: 32868
Terminal Pitch: .65 mm
Temperature Grade: COMMERCIAL EXTENDED
Maximum Supply Voltage (Vsup): 2 V
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