NXP Semiconductors - SSTUM32865ET/S

SSTUM32865ET/S by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SSTUM32865ET/S
Description D FLIP-FLOP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 160; Package Code: TFBGA; Package Shape: RECTANGULAR;
Datasheet SSTUM32865ET/S Datasheet
In Stock1,968
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Output Characteristics: OPEN-DRAIN
Maximum Seated Height: 1.15 mm
Trigger Type: POSITIVE EDGE
Minimum Supply Voltage (Vsup): 1.7 V
Sub-Category: Other Logic ICs
Surface Mount: YES
No. of Terminals: 160
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
JESD-30 Code: R-PBGA-B160
Package Shape: RECTANGULAR
Terminal Form: BALL
Minimum fmax: 450 MHz
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 9 mm
Moisture Sensitivity Level (MSL): 2
No. of Bits: 28
Output Polarity: TRUE
Logic IC Type: D FLIP-FLOP
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA160,12X18,25
Length: 13 mm
Propagation Delay (tpd): 1.4 ns
Nominal Supply Voltage / Vsup (V): 1.8
Family: SSTU
Terminal Pitch: .65 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 2 V
Power Supplies (V): 1.8
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