TDA18250BHN/C1K by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TDA18250BHN/C1K
Description	TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
Datasheet	TDA18250BHN/C1K Datasheet
In Stock	3,354

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.85 mm
Surface Mount:	YES
No. of Functions:	1
No. of Terminals:	32
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length:	5 mm
JESD-30 Code:	S-PQCC-N32
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Peak Reflow Temperature (C):	260
Package Code:	HVQCCN
Width:	5 mm
Terminal Pitch:	.5 mm
Moisture Sensitivity Level (MSL):	3

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,354	$0.802	$2,689.908

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