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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | TDA18250BHN/C1Y |
| Description | TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; |
| Datasheet | TDA18250BHN/C1Y Datasheet |
| In Stock | 1,580 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
568-15136-6 935299651518 TDA18250BHN/C1Y-ND 568-15136-1 568-15136-2 |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .85 mm |
| Surface Mount: | YES |
| No. of Functions: | 1 |
| No. of Terminals: | 32 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 5 mm |
| JESD-30 Code: | S-PQCC-N32 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HVQCCN |
| Width: | 5 mm |
| Terminal Pitch: | .5 mm |
| Moisture Sensitivity Level (MSL): | 3 |
