NXP Semiconductors - TDA3653BU

TDA3653BU by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA3653BU
Description VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Package Equivalence Code: SIP9,.1TB;
Datasheet TDA3653BU Datasheet
In Stock4,733
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Blanking Output: NO
Minimum Supply Voltage (Vsup): 10 V
Sub-Category: Deflection ICs
Surface Mount: NO
Terminal Finish: TIN
JESD-609 Code: e3
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
No. of Terminals: 9
Qualification: Not Qualified
Package Equivalence Code: SIP9,.1TB
Terminal Position: SINGLE
Package Style (Meter): FLANGE MOUNT
Technology: BIPOLAR
JESD-30 Code: R-PSFM-T9
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 150 Cel
General IC Type: VERTICAL DEFLECTION IC
Terminal Pitch: 2.54 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 60 V
Power Supplies (V): 10/40
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