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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | TDA3653BU |
Description | VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Package Equivalence Code: SIP9,.1TB; |
Datasheet | TDA3653BU Datasheet |
In Stock | 4,733 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Blanking Output: | NO |
Minimum Supply Voltage (Vsup): | 10 V |
Sub-Category: | Deflection ICs |
Surface Mount: | NO |
Terminal Finish: | TIN |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | 0 Cel |
No. of Functions: | 1 |
No. of Terminals: | 9 |
Qualification: | Not Qualified |
Package Equivalence Code: | SIP9,.1TB |
Terminal Position: | SINGLE |
Package Style (Meter): | FLANGE MOUNT |
Technology: | BIPOLAR |
JESD-30 Code: | R-PSFM-T9 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 150 Cel |
General IC Type: | VERTICAL DEFLECTION IC |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 60 V |
Power Supplies (V): | 10/40 |