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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | TDA3653BU |
| Description | VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Package Equivalence Code: SIP9,.1TB; |
| Datasheet | TDA3653BU Datasheet |
| In Stock | 4,733 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Blanking Output: | NO |
| Minimum Supply Voltage (Vsup): | 10 V |
| Sub-Category: | Deflection ICs |
| Surface Mount: | NO |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 9 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SIP9,.1TB |
| Terminal Position: | SINGLE |
| Package Style (Meter): | FLANGE MOUNT |
| Technology: | BIPOLAR |
| JESD-30 Code: | R-PSFM-T9 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 150 Cel |
| General IC Type: | VERTICAL DEFLECTION IC |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 60 V |
| Power Supplies (V): | 10/40 |
