NXP Semiconductors - TDA3653CU

TDA3653CU by NXP Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TDA3653CU
Description	VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR; Terminal Position: SINGLE;
Datasheet	TDA3653CU Datasheet
In Stock	3,229

TDA3653CU Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Blanking Output:	NO
Maximum Seated Height:	14.2 mm
Minimum Supply Voltage (Vsup):	10 V
Surface Mount:	NO
No. of Functions:	1
No. of Terminals:	9
Qualification:	Not Qualified
Terminal Position:	SINGLE
Package Style (Meter):	IN-LINE
Length:	23.8 mm
JESD-30 Code:	R-PSIP-T9
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Package Code:	SIP
General IC Type:	VERTICAL DEFLECTION IC
Width:	4.4 mm
Terminal Pitch:	2.54 mm
Maximum Supply Voltage (Vsup):	60 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,229	-	-

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