NXP Semiconductors - TDA8002CG/C1,518

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TDA8002CG/C1,518 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8002CG/C1,518
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet TDA8002CG/C1,518 Datasheet
In Stock550
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.6 mm
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Maximum Supply Current: 140 mA
Terminal Finish: TIN
No. of Terminals: 32
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PQFP-G32
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LFQFP
Width: 5 mm
Moisture Sensitivity Level (MSL): 3
Other Names: 568-3518-2
TDA8002CGB-T
568-3518-1
TDA8002CGC1518
935261709518
568-3518-6
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 6.5 V
JESD-609 Code: e3
Minimum Operating Temperature: -25 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP32,.28SQ,20
Length: 5 mm
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Power Supplies (V): 3.3/5
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