NXP Semiconductors - TDA8003TS

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TDA8003TS by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8003TS
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
Datasheet TDA8003TS Datasheet
In Stock470
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 24
Qualification: Not Qualified
Package Equivalence Code: SSOP24,.3
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, SHRINK PITCH
JESD-30 Code: R-PDSO-G24
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: SSOP
Terminal Pitch: .635 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.5,3
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