NXP Semiconductors - TDA8026ET/C2/S1,15

TDA8026ET/C2/S1,15 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8026ET/C2/S1,15
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: FBGA; Package Shape: SQUARE;
Datasheet TDA8026ET/C2/S1,15 Datasheet
In Stock2,760
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: 3.3 V
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Maximum Supply Current: 260 mA
Minimum Operating Temperature: -25 Cel
No. of Terminals: 64
Qualification: Not Qualified
Package Equivalence Code: BGA64,8X8,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B64
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 3.3
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