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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | TDA8026ET/C2/S1,15 |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | TDA8026ET/C2/S1,15 Datasheet |
In Stock | 2,760 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 3.3 V |
Sub-Category: | Other Microprocessor ICs |
Surface Mount: | YES |
Maximum Supply Current: | 260 mA |
Minimum Operating Temperature: | -25 Cel |
No. of Terminals: | 64 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA64,8X8,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
JESD-30 Code: | S-PBGA-B64 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 3.3 |