NXP Semiconductors - TDA8026ET/C2

TDA8026ET/C2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8026ET/C2
Description INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet TDA8026ET/C2 Datasheet
In Stock3,942
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.2 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 64
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B64
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Interface IC Type: INTERFACE CIRCUIT
Width: 7 mm
Moisture Sensitivity Level (MSL): 2
Maximum Supply Voltage: 5.5 V
JESD-609 Code: e1
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Length: 7 mm
Additional Features: ALSO OPERATE FROM 5.25 TO 5.5 V SUPPLY
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
3,942 $3.300 $13,008.600

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