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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | TDA8026ET/C3K |
| Description | INTERFACE CIRCUIT; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA64,8X8,32; |
| Datasheet | TDA8026ET/C3K Datasheet |
| In Stock | 599 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.7 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Supply Voltage: | 5.5 V |
| Maximum Seated Height: | 1.2 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -25 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 64 |
| Package Equivalence Code: | BGA64,8X8,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Length: | 7 mm |
| JESD-30 Code: | S-PBGA-B64 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | TFBGA |
| Interface IC Type: | INTERFACE CIRCUIT |
| Width: | 7 mm |
| Terminal Pitch: | .8 mm |
| Moisture Sensitivity Level (MSL): | 2 |
