NXP Semiconductors - TDA8351/N6,112

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TDA8351/N6,112 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8351/N6,112
Description VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR;
Datasheet TDA8351/N6,112 Datasheet
In Stock2,020
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Blanking Output: NO
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 14.2 mm
Minimum Supply Voltage (Vsup): 9 V
Surface Mount: NO
Terminal Finish: TIN
No. of Terminals: 9
Terminal Position: SINGLE
Package Style (Meter): IN-LINE
JESD-30 Code: R-PSIP-T9
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 75 Cel
Package Code: SIP
General IC Type: VERTICAL DEFLECTION IC
Width: 4.4 mm
JESD-609 Code: e3
Minimum Operating Temperature: -25 Cel
Qualification: Not Qualified
Length: 23.8 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL EXTENDED
Maximum Supply Voltage (Vsup): 25 V
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Pricing (USD)

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