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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | TDA8356 |
Description | VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR; |
Datasheet | TDA8356 Datasheet |
In Stock | 2,530 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Blanking Output: | NO |
Maximum Seated Height: | 14.2 mm |
Minimum Supply Voltage (Vsup): | 9 V |
Sub-Category: | Deflection ICs |
Surface Mount: | NO |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 9 |
Terminal Position: | SINGLE |
Package Style (Meter): | IN-LINE |
Technology: | BIPOLAR |
JESD-30 Code: | R-PSIP-T9 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 75 Cel |
Package Code: | SIP |
General IC Type: | VERTICAL DEFLECTION IC |
Width: | 4.4 mm |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -25 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | SIP9,.1 |
Length: | 23.8 mm |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL EXTENDED |
Maximum Supply Voltage (Vsup): | 25 V |
Power Supplies (V): | 9/25 |