NXP Semiconductors - TDA8822MDB-T

TDA8822MDB-T by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8822MDB-T
Description CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
Datasheet TDA8822MDB-T Datasheet
In Stock4,774
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Seated Height: 2 mm
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: YES
Maximum Supply Current: 72 mA
Terminal Finish: NICKEL PALLADIUM GOLD
JESD-609 Code: e4
Minimum Operating Temperature: -20 Cel
No. of Functions: 1
No. of Terminals: 24
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, SHRINK PITCH
Length: 8.2 mm
JESD-30 Code: R-PDSO-G24
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: SSOP
General IC Type: CONSUMER CIRCUIT
Width: 5.3 mm
Terminal Pitch: .65 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 5.5 V
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