
Image shown is a representation only.
Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | TEA1067PN |
Description | TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; |
Datasheet | TEA1067PN Datasheet |
In Stock | 2,165 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Telecom IC Type: | TELEPHONE SPEECH CIRCUIT |
Surface Mount: | NO |
Minimum Operating Temperature: | -25 Cel |
No. of Functions: | 1 |
No. of Terminals: | 18 |
Qualification: | Not Qualified |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
JESD-30 Code: | R-PDIP-T18 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Temperature Grade: | OTHER |