NXP Semiconductors - TEA1067PN

TEA1067PN by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1067PN
Description TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TEA1067PN Datasheet
In Stock2,165
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: TELEPHONE SPEECH CIRCUIT
Surface Mount: NO
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
No. of Terminals: 18
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
JESD-30 Code: R-PDIP-T18
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Temperature Grade: OTHER
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