NXP Semiconductors - TEA1069AH

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TEA1069AH by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1069AH
Description TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
Datasheet TEA1069AH Datasheet
In Stock4,079
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.7 V
Maximum Seated Height: 2.1 mm
Sub-Category: Telephone Circuits
Surface Mount: YES
Terminal Finish: TIN
No. of Terminals: 44
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: BIPOLAR
JESD-30 Code: S-PQFP-G44
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 75 Cel
Package Code: QFP
Width: 10 mm
Telecom IC Type: TELEPHONE MULTIFUNCTION CIRCUIT
JESD-609 Code: e3
Minimum Operating Temperature: -25 Cel
Make-break Ratio: 2:1
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: QFP44,.5SQ,32
Length: 10 mm
Additional Features: 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL EXTENDED
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