NXP Semiconductors - TEA1093

TEA1093 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1093
Description TELECOM CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TEA1093 Datasheet
In Stock1,362
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.6 V
Maximum Seated Height: 5.1 mm
Sub-Category: Telephone Circuits
Surface Mount: NO
Maximum Supply Current: 140 mA
Terminal Finish: TIN/NICKEL PALLADIUM GOLD
No. of Terminals: 28
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T28
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 75 Cel
Package Code: DIP
Width: 15.24 mm
Telecom IC Type: TELECOM CIRCUIT
JESD-609 Code: e3/e4
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP28,.6
Length: 35.5 mm
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 3.6
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