TEA1094AM-T by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TEA1094AM-T
Description	TELECOM CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
Datasheet	TEA1094AM-T Datasheet
In Stock	3,533

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	5 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	2 mm
Surface Mount:	YES
Maximum Supply Current:	4.4 mA
Minimum Operating Temperature:	-25 Cel
No. of Functions:	1
No. of Terminals:	24
Qualification:	Not Qualified
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, SHRINK PITCH
Length:	8.2 mm
Technology:	BIPOLAR
JESD-30 Code:	R-PDSO-G24
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	75 Cel
Package Code:	SSOP
Width:	5.3 mm
Terminal Pitch:	.65 mm
Temperature Grade:	COMMERCIAL EXTENDED

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,533	-	-

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