TEA1112 by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TEA1112
Description	TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet	TEA1112 Datasheet
In Stock	1,543

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	2.9 V
Telecom IC Type:	TELEPHONE SPEECH CIRCUIT
Sub-Category:	Telephone Circuits
Surface Mount:	NO
Maximum Supply Current:	.0014 mA
Minimum Operating Temperature:	-25 Cel
No. of Terminals:	16
Qualification:	Not Qualified
Package Equivalence Code:	DIP16,.3
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	BIPOLAR
JESD-30 Code:	R-PDIP-T16
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	70 Cel
Package Code:	DIP
Terminal Pitch:	2.54 mm
Temperature Grade:	OTHER
Power Supplies (V):	2.9

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,543	-	-

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