TEA1118AM by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TEA1118AM
Description	CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
Datasheet	TEA1118AM Datasheet
In Stock	3,964

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	2.9 V
Maximum Seated Height:	1.5 mm
Sub-Category:	Cordless Telephone ICs
Surface Mount:	YES
Maximum Supply Current:	.0014 mA
No. of Terminals:	16
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Technology:	BIPOLAR
JESD-30 Code:	R-PDSO-G16
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	75 Cel
Package Code:	LSSOP
Width:	4.4 mm
Telecom IC Type:	CORDLESS TELEPHONE BASEBAND CIRCUIT
Minimum Operating Temperature:	-25 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	SSOP16,.25
Length:	5.2 mm
Terminal Pitch:	.65 mm
Temperature Grade:	COMMERCIAL EXTENDED
Power Supplies (V):	2.9

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,964	-	-

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