NXP Semiconductors - TEA1708T/1J

TEA1708T/1J by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1708T/1J
Description Power Management Circuits; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
Datasheet TEA1708T/1J Datasheet
In Stock6,234
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Power Management Circuits
Surface Mount: YES
No. of Terminals: 8
Qualification: Not Qualified
Package Equivalence Code: SOP8,.25
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Peak Reflow Temperature (C): 260
Package Code: SOP
Terminal Pitch: 1.27 mm
Moisture Sensitivity Level (MSL): 1
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
6,234 - -

Popular Products

Category Top Products