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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | TFF1024HN/N1,115 |
| Description | RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Package Equivalence Code: LCC16,.1X.14,20; |
| Datasheet | TFF1024HN/N1,115 Datasheet |
| In Stock | 1,392 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
935297767115 568-TFF1024HN/N1,115CT 568-TFF1024HN/N1,115TR TFF1024HN/N1,115-ND 568-TFF1024HN/N1,115DKR |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | 1 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 16 |
| Package Equivalence Code: | LCC16,.1X.14,20 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 3.5 mm |
| JESD-30 Code: | R-PQCC-N16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HVQCCN |
| Width: | 2.5 mm |
| Terminal Pitch: | .5 mm |
| Moisture Sensitivity Level (MSL): | 1 |
