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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | XC912D60CPVE8 |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 112; Package Code: QFP; Package Shape: SQUARE; |
In Stock | 3,805 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 5 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 85 mA |
Terminal Finish: | TIN |
No. of Terminals: | 112 |
Terminal Position: | QUAD |
Package Style (Meter): | FLATPACK |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | S-PQFP-G112 |
Package Shape: | SQUARE |
ROM Words: | 30720 |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 85 Cel |
Package Code: | QFP |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 8 rpm |
RAM Bytes: | 2048 |
External Data Bus Width: | 0 |
Bit Size: | 16 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | QFP112,.87SQ |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Terminal Pitch: | .635 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 5 |
CPU Family: | CPU12 |