NXP Semiconductors - XCB56012BU95

XCB56012BU95 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XCB56012BU95
Description DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet XCB56012BU95 Datasheet
In Stock1,020
NAME DESCRIPTION
Minimum Supply Voltage: 4.75 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Seated Height: 1.7 mm
Sub-Category: Digital Signal Processors
Surface Mount: YES
Maximum Supply Current: 150 mA
No. of Terminals: 100
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Address Bus Width: 0
Technology: HCMOS
RAM Words: 8448
JESD-30 Code: S-PQFP-G100
Maximum Clock Frequency: 95 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 90 Cel
Package Code: LFQFP
Width: 14 mm
Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage: 5.25 V
Low Power Mode: YES
Boundary Scan: NO
External Data Bus Width: 0
Bit Size: 24
Minimum Operating Temperature: 0 Cel
Internal Bus Architecture: MULTIPLE
Qualification: Not Qualified
Package Equivalence Code: QFP100,.63SQ,20
Length: 14 mm
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Power Supplies (V): 5
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