NXP Semiconductors - XCB56364PV100

XCB56364PV100 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XCB56364PV100
Description DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 112; Package Code: LQFP; Package Shape: SQUARE;
Datasheet XCB56364PV100 Datasheet
In Stock4,790
NAME DESCRIPTION
Minimum Supply Voltage: 3.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.6 mm
Sub-Category: Digital Signal Processors
Surface Mount: YES
Maximum Supply Current: 181 mA
No. of Terminals: 112
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK, LOW PROFILE
Address Bus Width: 18
Technology: CMOS
RAM Words: 2560
JESD-30 Code: S-PQFP-G112
Maximum Clock Frequency: 100 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 105 Cel
Package Code: LQFP
Width: 20 mm
Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage: 3.46 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 8
Bit Size: 24
Barrel Shifter: YES
Minimum Operating Temperature: 0 Cel
Internal Bus Architecture: MULTIPLE
Qualification: Not Qualified
Package Equivalence Code: QFP112(UNSPEC)
Length: 20 mm
Terminal Pitch: .65 mm
Temperature Grade: OTHER
Power Supplies (V): 3.3
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