NXP Semiconductors - XPC107APX100LC

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XPC107APX100LC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC107APX100LC
Description Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 503; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 2.5 V;
In Stock3,499
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.5 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Supply Voltage: 2.625 V
Maximum Seated Height: 2.75 mm
Boundary Scan: YES
Surface Mount: YES
No. of Terminals: 503
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 33 mm
Technology: CMOS
RAM Words: 256
JESD-30 Code: S-PBGA-B503
Maximum Clock Frequency: 66 MHz
Package Shape: SQUARE
Terminal Form: BALL
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: BGA
Bus Compatibility: PCI
Width: 33 mm
Terminal Pitch: 1.27 mm
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Pricing (USD)

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