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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | XPC745BPX300LD |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 255; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; |
Datasheet | XPC745BPX300LD Datasheet |
In Stock | 1,977 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.9 V |
Package Body Material: | PLASTIC/EPOXY |
Speed: | 300 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Nominal Supply Voltage: | 2 V |
Integrated Cache: | NO |
Maximum Supply Voltage: | 2.1 V |
Low Power Mode: | NO |
Boundary Scan: | YES |
Surface Mount: | YES |
No. of Terminals: | 255 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B255 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Package Code: | BGA |