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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | XPC755BPX400LD |
| Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: RECTANGULAR; Minimum Supply Voltage: 1.9 V; |
| Datasheet | XPC755BPX400LD Datasheet |
| In Stock | 4,662 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.9 V |
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 400 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Nominal Supply Voltage: | 2 V |
| Integrated Cache: | NO |
| Maximum Supply Voltage: | 2.1 V |
| Low Power Mode: | NO |
| Boundary Scan: | YES |
| Surface Mount: | YES |
| No. of Terminals: | 360 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B360 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Package Code: | BGA |









