NXP Semiconductors - XPC755BRX350LD

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XPC755BRX350LD by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC755BRX350LD
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
Datasheet XPC755BRX350LD Datasheet
In Stock1,781
NAME DESCRIPTION
Minimum Supply Voltage: 1.9 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Speed: 350 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Nominal Supply Voltage: 2 V
Integrated Cache: NO
Maximum Supply Voltage: 2.1 V
Low Power Mode: NO
Boundary Scan: YES
Surface Mount: YES
No. of Terminals: 360
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-CBGA-B360
Package Shape: RECTANGULAR
Terminal Form: BALL
Package Code: BGA
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