NXP Semiconductors - XPC823EZT75B2

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XPC823EZT75B2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC823EZT75B2
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;
Datasheet XPC823EZT75B2 Datasheet
In Stock4,015
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.35 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: Tin/Lead/Silver (Sn/Pb/Ag)
No. of Terminals: 256
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 26
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 5 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Speed: 75 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 3.6 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA256,23X23,50
Length: 23 mm
Peak Reflow Temperature (C): 220
Terminal Pitch: 1.27 mm
Power Supplies (V): 3.3
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