NXP Semiconductors - XPC8245TZU266B

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XPC8245TZU266B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC8245TZU266B
Description MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 352; Package Code: BGA; Package Shape: SQUARE;
Datasheet XPC8245TZU266B Datasheet
In Stock923
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: YES
Maximum Seated Height: 1.65 mm
Surface Mount: YES
On Chip Data RAM Width: 32
No. of Terminals: 352
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B352
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Width: 35 mm
Speed: 266 rpm
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 1.9 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA352,26X26,50
Length: 35 mm
Additional Features: ALSO OPERATES AT 2V SUPPLY
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
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