Omron - 8PFA1

  1. Home
  2. Omron - 8PFA1
8PFA1 by Omron

Image shown is a representation only.

Manufacturer Omron
Manufacturer's Part Number 8PFA1
Description RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
Datasheet 8PFA1 Datasheet
NAME DESCRIPTION
IC Socket Type: Relay Socket
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

2271028 by Phoenix Contact

2271028

Phoenix Contact

RELAY SOCKET;
200-6311-9UN-1900 by 3m Electronic Products Division

200-6311-9UN-1900

3m Electronic Products Division

The 3M Electronic Products Division's 200-6311-9UN-1900 is a Chip Carrier IC Socket with POLYETHERSULFONE housing. It features 121 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) finish for PGA121 devices. Ideal for high-performance electronic applications requiring reliable connections.
5-1393159-1 by TE Connectivity

5-1393159-1

TE Connectivity

RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
HLT-1910-G-T by Samtec

HLT-1910-G-T

Samtec

The Samtec HLT-1910-G-T is a 190-contact IC socket with brass contacts and gold over nickel finish. It is designed for use on PGA190 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections and durability.
9-1437514-4 by TE Connectivity

9-1437514-4

TE Connectivity

TE Connectivity 9-1437514-4 is a Chip Carrier IC Socket with 7.62mm PCB contact spacing, -55 to 105°C temp range, and 3A current rating. Ideal for PRESS FIT termination in electronic applications requiring high insulation resistance and precise mating contact pitch of 0.1 inch.
XR2A-2821-N by Omron

XR2A-2821-N

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH;
8448-001 by Amphenol Communications Solutions

8448-001

Amphenol Communications Solutions

Amphenol's 8448-001 IC Socket features staggered contact configuration with 335 contacts on a LGA335 device. With a PCB row spacing of 1.27mm and surface mount termination, it is ideal for straight mounting on PCBs. The socket uses glass-filled polyetherimide housing material for durability in electronic applications.
2833602 by Phoenix Contact

2833602

Phoenix Contact

RELAY SOCKET;
60431011 by Delphi Connection Systems

60431011

Delphi Connection Systems

RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
342-90-139-00-592000 by Mill-max Mfg

342-90-139-00-592000

Mill-max Mfg

Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
1571552-4 by TE Connectivity

1571552-4

TE Connectivity

TE Connectivity's 1571552-4 is a chip carrier IC socket with PCB contact row spacing of 7.62mm and rectangular contact pattern. It is made of thermoplastic polyester and used on DIP16 devices. With a rating of 3A, it has a max operating temperature of 105°C and insulation resistance of 5GΩ.
1-822473-7 by TE Connectivity

1-822473-7

TE Connectivity

TE Connectivity 1-822473-7 is a PLCC84 IC socket with POLYETHYLENE housing. Featuring 84 contacts, it has an insulation resistance of 1G ohm and dielectric voltage of 830VAC. Ideal for applications requiring a straight mounting style, this socket operates b/w -20°C to 85°C and can handle up to 1A current rating.
XR2D-4001-N by Omron

XR2D-4001-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
540-88-044-17-400-TR by Preci-dip Sa

540-88-044-17-400-TR

Preci-dip Sa

IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Additional Features: STANDARD: UL 94V-0, LOW PROFILE; No. of Contacts: 44; Contact Material: NOT SPECIFIED;
27E461 by TE Connectivity

27E461

TE Connectivity

IC SOCKET; Housing Material: PHENOLIC; No. of Contacts: 16; Termination Type: SCREW; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
ICO-314-STT by Samtec

ICO-314-STT

Samtec

ICO-314-STT by Samtec is a DIP14 IC socket with 14 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It uses beryllium copper contacts with tin over nickel finish for a current rating of 1A. Ideal for applications requiring a dielectric voltage withstand of 1400VAC in temperatures ranging from -55 to 105°C.
PR3-BSC1/3X21 by Phoenix Contact

PR3-BSC1/3X21

Phoenix Contact

RELAY SOCKET; Device Type Used On: RELAY; Rating (Current): 10 A; Maximum Operating Temperature: 85 Cel; Body Length: 2.95 inch; Body Width: 1.496 inch;
XR2A-2011-N by Omron

XR2A-2011-N

Omron

IC SOCKET; Device Type Used On: DIP20; No. of Contacts: 20; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
8080-1G14 by TE Connectivity

8080-1G14

TE Connectivity

TE Connectivity's 8080-1G14 is a PHENOLIC chip carrier socket for TO-3 devices. With 3 contacts, it has a current rating of 10A and can withstand up to 2121VAC. Ideal for applications requiring a straight mounting style and round pin sockets in temperatures ranging from -55°C to 125°C.
PYFZ-08-E by Omron

PYFZ-08-E

Omron

RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;