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| Manufacturer | Omron |
|---|---|
| Manufacturer's Part Number | HMC-EF183 |
| Description | MEMORY CIRCUIT; Package Code: DIE; Package Shape: RECTANGULAR; Technology: CMOS; No. of Words: 134217728 words; Peak Reflow Temperature (C): NOT SPECIFIED; |
| Datasheet | HMC-EF183 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
HMC-EF183-ND Z3173 HMCEF183 |
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 1073741824 bit |
| Organization: | 128MX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Words: | 134217728 words |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| No. of Words Code: | 128M |
| JESD-30 Code: | R-XUUC-N |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | DIE |
