Omron - XR2A-0811-N

TE Connectivity's 1-2199298-3 is a Chip Carrier IC Socket with 14 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It is used for DIP14 devices, has a solder termination type, and operates b/w -40°C to 105°C.

RELAY SOCKET;

IC SOCKET; Manufacturer Series: XR2;

Aries Electronics 40-6552-11 is a DIP42 IC socket with 40 contacts made of beryllium copper. The housing material is polyphenylene sulfide, and the contact finish includes gold over nickel. Ideal for chip carrier applications requiring reliable connections in electronic devices.

RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: M12883; JESD-609 Code: e4; No. of Contacts: 8; Contact Finish (Mating): GOLD;

Mill-max Mfg's 510-93-169-17-101003 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier IC applications.

150-90-314-00-001000 by Mill-max Mfg is a PLASTIC chip carrier IC socket for DIP14 devices with 14 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for mating and Tin/Lead (Sn/Pb) with Nickel (Ni) barrier for termination. Ideal for rectangular ICs, this socket is commonly used in electronic applications requiring reliable connections.

IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Contact Material: NOT APPLICABLE; Termination Type: SOLDER LUG; No. of Contacts: 16;

Amphenol's 69802-144LF is a PLCC44 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 44 contacts made of PHOSPHOR BRONZE, it has a current rating of 1A and operates b/w -55°C to 125°C. Ideal for surface mount applications, it offers high insulation resistance and dielectric voltage withstand capabilities.

The 3M Electronic Products Division's 200-6321-9UN-1900 is a PGA441 IC socket with POLYETHERSULFONE housing and BERYLLIUM COPPER contacts. It features 441 gold (Au) over nickel (Ni) finished contacts for mating, suitable for chip carrier ICs. Ideal for high-performance electronic applications requiring reliable connections.

The Samtec APH-1016-G-T is a Chip Carrier IC Socket with 16 contacts made of brass and gold finish. It features a polyethylene housing material, suitable for DIP16 devices. This rectangular IC socket is designed for applications requiring reliable connections in electronic circuits.

RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSL; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;

IC SOCKET; Device Type Used On: QFP44; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 44;

IC SOCKET; Device Type Used On: PQFP132; Housing Material: PLASTIC; No. of Contacts: 132; Manufacturer Series: 5778;

110-87-628-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, rated for 1A current. It features Beryllium Copper contacts with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing material. With a temperature range of -55 to 125 °C, it's ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capability up to 1400VAC.

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;

510-93-169-17-101002 by Mill-max Mfg is a Chip Carrier IC Socket with 169 contacts, PCB contact row spacing of 2.54mm, and rectangular contact pattern. It is used on PGA169 devices, has a solder termination type, and operates b/w -55°C to 125°C.

The Mill-max Mfg 416-43-226-41-001000 is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It is used in Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.

TE Connectivity 1-2199299-2 is a DIP28 IC socket with 28 contacts, 15.24mm PCB row spacing, and glass-filled PBT housing material. It has a mating contact pitch of 0.1", solder termination, and operates b/w -40°C to 105°C. Ideal for applications requiring a reliable chip carrier socket with rectangular contact pattern and straight mounting style.

IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2;