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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | AX-SIP-SFEU-1-01-TB05 |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 44; Package Code: HVBCC; Package Shape: RECTANGULAR; |
| Datasheet | AX-SIP-SFEU-1-01-TB05 Datasheet |
| In Stock | 2,441 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2 V |
| Package Body Material: | UNSPECIFIED |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 3 V |
| Maximum Supply Voltage: | 3.6 V |
| Maximum Seated Height: | .996 mm |
| Surface Mount: | YES |
| Terminal Finish: | Nickel/Palladium/Gold (Ni/Pd/Au) |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -30 Cel |
| No. of Terminals: | 44 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 9 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-XBCC-B44 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HVBCC |
| Width: | 7 mm |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 3 |









