
Image shown is a representation only.
Manufacturer | Onsemi |
---|---|
Manufacturer's Part Number | AX-SIP-SFEU-1-01-TB05 |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 44; Package Code: HVBCC; Package Shape: RECTANGULAR; |
Datasheet | AX-SIP-SFEU-1-01-TB05 Datasheet |
In Stock | 2,441 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 2 V |
Package Body Material: | UNSPECIFIED |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 3 V |
Maximum Supply Voltage: | 3.6 V |
Maximum Seated Height: | .996 mm |
Surface Mount: | YES |
Terminal Finish: | Nickel/Palladium/Gold (Ni/Pd/Au) |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -30 Cel |
No. of Terminals: | 44 |
Terminal Position: | BOTTOM |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Length: | 9 mm |
Technology: | CMOS |
JESD-30 Code: | R-XBCC-B44 |
Package Shape: | RECTANGULAR |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | HVBCC |
Width: | 7 mm |
Temperature Grade: | OTHER |
Moisture Sensitivity Level (MSL): | 3 |