Onsemi - AX-SIP-SFEU-API-1-01-TX30

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AX-SIP-SFEU-API-1-01-TX30 by Onsemi

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Manufacturer Onsemi
Manufacturer's Part Number AX-SIP-SFEU-API-1-01-TX30
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 44; Package Code: HVBCC; Package Shape: RECTANGULAR;
Datasheet AX-SIP-SFEU-API-1-01-TX30 Datasheet
In Stock782
NAME DESCRIPTION
Minimum Supply Voltage: 2 V
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: .996 mm
Surface Mount: YES
Terminal Finish: NICKEL GOLD PALLADIUM
No. of Terminals: 44
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Technology: CMOS
JESD-30 Code: R-XBCC-B44
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Package Code: HVBCC
Width: 7 mm
Moisture Sensitivity Level (MSL): 3
Other Names: 1990-AX-SIP-SFEU-API-1-01-TX30DKR
AX-SIP-SFEU-API-1-01-TX30OSTR
1990-AX-SIP-SFEU-API-1-01-TX30TR
AX-SIP-SFEU-API-1-01-TX30OSCT
AX-SIP-SFEU-API-1-01-TX30OSDKR
1990-AX-SIP-SFEU-API-1-01-TX30CT
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 3.6 V
Minimum Operating Temperature: -30 Cel
Length: 9 mm
Peak Reflow Temperature (C): 260
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
782 $3.830 $2,995.060

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