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Manufacturer | Onsemi |
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Manufacturer's Part Number | AX8052F143-3-TX30 |
Description | SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; |
Datasheet | AX8052F143-3-TX30 Datasheet |
In Stock | 3,383 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.8 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1 mm |
Surface Mount: | YES |
Terminal Finish: | NICKEL GOLD PALLADIUM |
No. of Terminals: | 40 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | R-PQCC-N40 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVQCCN |
Width: | 5 mm |
Moisture Sensitivity Level (MSL): | 1 |
Peripheral IC Type: | SYSTEM ON CHIP |
Maximum Supply Voltage: | 3.6 V |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | LCC40,.2X.28,20 |
Length: | 7 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |