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Manufacturer | Onsemi |
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Manufacturer's Part Number | FSA551UCX |
Description | SPST; Temperature Grade: INDUSTRIAL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
Datasheet | FSA551UCX Datasheet |
In Stock | 101,673 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Width (mm): | 1.21 mm |
Maximum Seated Height: | .619 mm |
Minimum Supply Voltage (Vsup): | 1.5 V |
Maximum Supply Current (Isup): | .12 mA |
Nominal On-state Resistance Match: | .01 ohm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 9 |
Maximum On-state Resistance (Ron): | .6 ohm |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B9 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
No. of Channels: | 2 |
Package Code: | VFBGA |
Moisture Sensitivity Level (MSL): | 1 |
Nominal Off-state Isolation: | 75 dB |
Normal Position (V): | NC |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Package Equivalence Code: | BGA9,3X3,16 |
Other IC type: | SPST |
Length: | 1.38 mm |
Output (V): | SEPARATE OUTPUT |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .4 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3 V |