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Manufacturer | Onsemi |
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Manufacturer's Part Number | LC898113-TBM-H |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 49; Package Code: VFLGA; Package Shape: SQUARE; |
Datasheet | LC898113-TBM-H Datasheet |
In Stock | 368 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.7 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .8 mm |
Surface Mount: | YES |
No. of Terminals: | 49 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B49 |
Package Shape: | SQUARE |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFLGA |
Width: | 4 mm |
Moisture Sensitivity Level (MSL): | 4 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 3.6 V |
Minimum Operating Temperature: | -30 Cel |
Length: | 4 mm |
Additional Features: | ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | OTHER |