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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | LC898113-TBM-H |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 49; Package Code: VFLGA; Package Shape: SQUARE; |
| Datasheet | LC898113-TBM-H Datasheet |
| In Stock | 368 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.7 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .8 mm |
| Surface Mount: | YES |
| No. of Terminals: | 49 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B49 |
| Package Shape: | SQUARE |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFLGA |
| Width: | 4 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Supply Voltage: | 3.6 V |
| Minimum Operating Temperature: | -30 Cel |
| Length: | 4 mm |
| Additional Features: | ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |








