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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | LC898119XC-MH |
| Description | INTERFACE CIRCUIT; Terminal Form: BALL; No. of Terminals: 25; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage-1: 2.6 V; |
| Datasheet | LC898119XC-MH Datasheet |
| In Stock | 1,720 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.6 V |
| Package Body Material: | PLASTIC/EPOXY |
| Minimum Supply Voltage-1: | 2.6 V |
| Nominal Supply Voltage: | 3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .675 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 25 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B25 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | VFBGA |
| Interface IC Type: | INTERFACE CIRCUIT |
| Width: | 2 mm |
| Maximum Supply Voltage-1: | 3.6 V |
| Moisture Sensitivity Level (MSL): | 1 |
| Maximum Supply Voltage: | 3.6 V |
| JESD-609 Code: | e1 |
| No. of Functions: | 1 |
| Length: | 2 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
