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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | LC898124EP3XC-MH |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 27; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | LC898124EP3XC-MH Datasheet |
| In Stock | 981 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.6 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 2.8 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .33 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 27 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B27 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 1.3 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Supply Voltage: | 3.3 V |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -30 Cel |
| Package Equivalence Code: | BGA27,3X9,16 |
| Length: | 3.89 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | OTHER |
