Onsemi - LC898129DP1XHTBG

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LC898129DP1XHTBG by Onsemi

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Manufacturer Onsemi
Manufacturer's Part Number LC898129DP1XHTBG
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 40; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet LC898129DP1XHTBG Datasheet
In Stock123
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.8 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: .35 mm
Surface Mount: YES
Terminal Finish: TIN SILVER
No. of Terminals: 40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
JESD-30 Code: R-PBGA-B40
Maximum Clock Frequency: 1 MHz
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 1.6 mm
Moisture Sensitivity Level (MSL): 1
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 3.3 V
JESD-609 Code: e2
Minimum Operating Temperature: -30 Cel
Package Equivalence Code: BGA40,4X10,16
Length: 4.15 mm
Peak Reflow Temperature (C): 260
Bus Compatibility: I2C, SPI
Terminal Pitch: .4 mm
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
123 $3.780 $464.940

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