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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | LC898212XC-MH |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 12; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; |
| Datasheet | LC898212XC-MH Datasheet |
| In Stock | 515 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .69 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| No. of Functions: | 1 |
| No. of Terminals: | 12 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 1.77 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B12 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | VFBGA |
| Width: | 1.37 mm |
| Terminal Pitch: | .4 mm |
| Moisture Sensitivity Level (MSL): | 1 |
