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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | LE2416RLBXA-SH |
| Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: FBGA; Package Shape: RECTANGULAR; Memory Width: 8; |
| Datasheet | LE2416RLBXA-SH Datasheet |
| In Stock | 54 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000002 Amp |
| Organization: | 2KX8 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | EEPROMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 5 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 6 |
| I2C Control Byte: | 1010MMMR |
| No. of Words: | 2048 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Write Protection: | HARDWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 1 |
| Serial Bus Type: | I2C |
| Memory Density: | 16384 bit |
| Memory IC Type: | EEPROM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA6,2X3,16 |
| No. of Words Code: | 2K |
| Minimum Data Retention Time: | 20 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.8/3.3 |
